ACM Research

Supplies semiconductor process equipment spanning front-end wafer fabrication and advanced packaging. Wet-cleaning systems—single-wafer, Tahoe, and semi-critical tools—remain the core business, complemented by electrochemical plating, vertical furnace, PECVD, Track, coating, developing, stripping, scrubbing, and wet-etch equipment. Proprietary SAPS, TEBO, and Tahoe processes target particle removal, pattern protection, throughput, and lower chemical consumption across foundry, logic, memory, and packaging applications.

Develops, manufactures, sells, and services equipment principally through ACM Shanghai, while sales and support teams extend into North America, Europe, and Southeast Asia. Substantially all semiconductor-equipment sales still come from customers in mainland China, despite recent deployments elsewhere. ACM Shanghai is separately listed on the STAR Market and is pursuing a Hong Kong listing; ACM Shanghai and ACM Korea are on the U.S. Entity List, restricting access to items subject to U.S. export controls.