LEND · NASDAQ

SEI High Yield Bond & Alternative Credit ETF (LEND)

$24.90
At close+0.03 (+0.14%)
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SEI High Yield Bond & Alternative Credit ETFLEND

Not reported.

Company facts

ListedMay 18, 2026
ExchangeNASDAQ
CountryUnited States
ISINUS81589A8743

Market cap$1.03B
EPS (ttm)
P/E (ttm)
ROE
P/B
P/S
Dividend yieldDiv yield0.57%
Beta

No analyst consensus on record.

Not reported.

Not reported.

Next ex-date
Aug 5, 2027
estimated · in 336 days
Annual dividend
$0.14
per share
Dividend yield
0.57%
Schedule
Annual
one payment a year

Last cut to $0.1412 from $0.245 in Aug 2026. To collect a payout, hold shares through the close before the ex-date.

History

Ex-dateRecordPaidAmountNote
Aug 5, 2026Aug 5Aug 6$0.1412cut from $0.245
Jul 6, 2026Jul 6Jul 7$0.245
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No ownership filings on record for this listing.

Not reported.